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Engineering and consultancy

  • Product design and development of “Glass Sealed Microsystems” for MedTech devices and medical implants
  • Manufacturing process development and qualification to standards
  • Die bonding, wire bonding and ball grid bonding on glass
  • Development of glass carriers for MEMS and dies to achieve next step in device miniaturisation
engineering-consultancy
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Metal deposition
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Glass spacers
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Die and wire bonding
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Through-glass vias

Contact us

info@yalosys.com
+41 76 284 60 36